AlScN
AlScN Aluminum Scandium Nitride Material for Advanced Energy and Thin Film Applications
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AlScN
Aluminum Scandium Nitride
AlScN
AlScN
Aluminum Scandium Nitride (AlScN)
Product Description
AlScN is a high performance piezoelectric nitride material composed of aluminum, scandium, and nitrogen, widely used in semiconductor manufacturing, thin film deposition, MEMS devices, and RF communication technologies. These materials are valued for their enhanced piezoelectric response, excellent thermal stability, high electrical insulation, and compatibility with advanced semiconductor processes.
Product Specifications
Composition: Al, Sc, N (various atomic ratios)
Purity: ≥ 99.99%
Density: ≥ 90% theoretical density
Dimension: OD 50.8 mm – 450.0 mm
Tolerance diameter: ±0.1 mm
Thickness tolerance: ±0.1 mm
Surface Roughness: 32 RMS
AlScN Materials
High purity AlScN material is designed for semiconductor manufacturing, thin film deposition, and advanced piezoelectric applications. AlScN belongs to the family of functional nitride materials widely used in MEMS devices, bulk acoustic wave (BAW) filters, surface acoustic wave (SAW) devices, RF front-end components, and advanced sensor technologies.
These materials are engineered to provide superior piezoelectric performance, excellent thermal stability, and reliable dielectric properties. By carefully controlling composition and crystal structure, AlScN materials can be optimized for both research and industrial applications.
This material is commonly used in advanced electronics, semiconductor research, RF communication devices, and thin film deposition processes.
Applications of AlScN Materials
AlScN materials are widely used in advanced semiconductor and communication technologies.
Common applications include:
- Semiconductor and thin film research
- Thin film deposition and sputtering targets
- Bulk acoustic wave (BAW) filters
- Surface acoustic wave (SAW) devices
- MEMS sensors and actuators
- RF and 5G communication components
- Advanced materials research and development
The ability to control the composition of AlScN allows engineers and researchers to optimize piezoelectric performance, electromechanical coupling, thermal stability, and device efficiency for specialized applications.
AlScN Sputtering Targets for Thin Film Deposition
AlScN sputtering targets are used in physical vapor deposition (PVD) processes to produce high quality piezoelectric thin films with excellent compositional uniformity and electromechanical performance. These targets enable precise control of material composition during deposition, making them ideal for research laboratories, semiconductor manufacturing environments, and advanced materials development.
Thin films produced using AlScN sputtering targets are commonly applied in MEMS devices, BAW and SAW filters, RF front-end modules, piezoelectric sensors, actuators, and next-generation wireless communication systems.
Notice: Pioneer Materials can manufacture custom AlScN sputtering targets and nitride materials according to specific customer requirements, including tailored composition, density, dimensions, backing plate bonding, and custom geometries.
Request a Quote for AlScN Materials
Contact Pioneer Materials to learn more about our high purity AlScN materials and custom sputtering targets. Our team can provide customized compositions, dimensions, bonding options, and manufacturing solutions designed to meet your semiconductor, MEMS, RF communication, piezoelectric, and advanced thin film deposition requirements.
Request a Quote
Please fill out the form with your specific requirements, and our dedicated team will promptly review your request and provide you with a comprehensive quotation tailored to your needs. We are committed to delivering the highest quality materials and exceptional service to meet your unique demands.
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