TiN
TiN Titanium Nitride Material for Advanced Energy and Thin Film Applications
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TiN
Titanium Nitride
TiN
TiN
Titanium Nitride (TiN)
Product Description
TiN is a transition metal nitride material composed of titanium and nitrogen, widely used in semiconductor manufacturing, thin film deposition, hard protective coatings, and advanced electronic applications. These materials are valued for their excellent electrical conductivity, high hardness, wear resistance, thermal stability, and corrosion resistance.
Product Specifications
Composition: Ti, N (various atomic ratios)
Purity: ≥ 99.99%
Density: ≥ 90% theoretical density
Dimension: OD 50.8 mm – 450.0 mm
Tolerance diameter: ±0.1 mm
Thickness tolerance: ±0.1 mm
Surface Roughness: 32 RMS
TiN Materials
High purity TiN material is designed for semiconductor manufacturing, thin film deposition, and advanced coating applications. TiN belongs to the family of transition metal nitride materials widely used in integrated circuits, diffusion barriers, hard coatings, and electronic components.
These materials are engineered to provide excellent electrical conductivity, mechanical durability, and chemical stability. By carefully controlling composition and microstructure, TiN materials can be optimized for both research and industrial applications.
This material is commonly used in advanced electronics, semiconductor research, protective coatings, and thin film deposition processes.
Applications of TiN Materials
TiN materials are widely used in advanced semiconductor and industrial technologies.
Common applications include:
- Semiconductor and thin film research
- Thin film deposition and sputtering targets
- Diffusion barrier layers for integrated circuits
- Hard protective coatings for cutting and forming tools
- Microelectronics and MEMS devices
- Decorative wear-resistant coatings
- Advanced materials research and development
The ability to control the composition of TiN allows engineers and researchers to optimize electrical conductivity, hardness, wear resistance, and thermal stability for specialized applications.
TiN Sputtering Targets for Thin Film Deposition
TiN sputtering targets are used in physical vapor deposition (PVD) processes to produce high quality nitride thin films with excellent adhesion, conductivity, and wear resistance. These targets enable precise control of material composition during deposition, making them ideal for research laboratories, semiconductor manufacturing environments, and advanced materials development.
Thin films produced using TiN sputtering targets are commonly applied in semiconductor devices, diffusion barrier layers, hard coatings, MEMS devices, and advanced electronic systems.
Notice: Pioneer Materials can manufacture custom TiN sputtering targets and compound materials according to specific customer requirements, including tailored composition, density, dimensions, backing plate bonding, and custom geometries.
Request a Quote for TiN Materials
Contact Pioneer Materials to learn more about our high purity TiN materials and custom sputtering targets. Our team can provide customized compositions, dimensions, bonding options, and manufacturing solutions designed to meet your semiconductor, coating, and advanced thin film deposition requirements.
Request a Quote
Please fill out the form with your specific requirements, and our dedicated team will promptly review your request and provide you with a comprehensive quotation tailored to your needs. We are committed to delivering the highest quality materials and exceptional service to meet your unique demands.
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