Other than the standard composition and dimension of our products, the company is able to provide custom-made sputtering targets and compound materials based on the customers’ specific requirements in density, composition and dimensions.
PMI can manufacture target sizes in the range from 50.8 mm to 450 mm diameter, including various geometries such as round disk, square, or ring type are custom-made for our customers. Powder size can be made from -80 mesh to -400 mesh. In conjunction with PMI’s target sales, the company can also offer engineering consulting services for sputtering processing.
PMI provides bonding channels and services for our customers worldwide. PMI is also capable of making various types of backing plate to be bonded with PMI’s targets. The backing plate materials could be Cu, CuCr, or Mo type, as well as other special backing plate surface metallization requirements.
Our bonding is of the highest quality at a very competitive price.
We offer local bonding services for Taiwan and North America.
We utilize ultra-sonic bonding techniques to minimize incorporation of oxides and voids at the critical bonding interface. Oxides/voids can cause localized heating which can result in ununiform heat and eventual debonding.
We can use either solder or elastomer that sits tightly between the target material and the backing plate, giving it superior thermal as well as electrical performance.
Along with the products, PMI provides a Certificate of Analysis, detailing purity, composition uniformity, stoichiometry, density, electrical resisitivity, surface roughness, and so on.
Indium bonding, also known as indium soldering or indium sealing, is a process that involves using indium, a soft and malleable metal, to create a bond between two surfaces. This technique is used in various industries and applications due to its unique properties.
Industries: Semiconductor and Electronics, Aerospace and Defense, Medical Device Manufacturing, Telecommunications, Research and Scientific Instruments, Renewable Energy (Solar), Automotive (for power electronics).
Uses and Applications: Semiconductor Bonding, Thermal Interface Materials (TIMs), Vacuum Sealing, Medical Device Assembly, Aerospace Bonding, Photovoltaic Assembly, Telecommunications Components, Scientific Instrumentation, Renewable Energy, Automotive Electronics and Optoelectronic Devices.
Elastomer bonding is a process that involves attaching or bonding elastomeric materials (rubber-like compounds) to other substrates or surfaces. This technique is employed in various industries and applications due to the unique properties of elastomers. Here’s an overview:
Process: Elastomer bonding typically involves applying adhesives or using specialized techniques to bond elastomeric materials like rubber to different surfaces, such as metals, plastics, or other elastomers.
Elastomeric Materials: Elastomers are known for their flexibility, resilience, and ability to deform under stress and return to their original shape when stress is removed.
Uses and Applications: Elastomer bonding is utilized in the automotive, manufacturing, medical, electronics, aerospace, construction, consumer goods, energy, and packaging industries.
Whether you seek technical consultations or have inquiries about our advanced materials, we are here to assist you. Let’s collaborate to bring your innovative ideas to life. Contact us today and pave the way for technological evolution.